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Joined forces! Dinglong officially launched the ICMtia joint analysis, testing and technical cooperation service platform

(Summary description)From May 11, 2020, the joint analysis, testing, and technical cooperation service platform (hereinafter referred to as the service platform) has been officially put into use on the official website of ICMtia (Integrated Circuit Material Industry Technology Innovation Alliance).

Joined forces! Dinglong officially launched the ICMtia joint analysis, testing and technical cooperation service platform

(Summary description)From May 11, 2020, the joint analysis, testing, and technical cooperation service platform (hereinafter referred to as the service platform) has been officially put into use on the official website of ICMtia (Integrated Circuit Material Industry Technology Innovation Alliance).

Information

From May 11, 2020, the joint analysis, testing, and technical cooperation service platform (hereinafter referred to as the service platform) has been officially put into use on the official website of ICMtia (Integrated Circuit Material Industry Technology Innovation Alliance).

(Click "Read the original text" at the bottom of the article to go directly to the platform page)

 

The service platform is a professional service platform led by the Materials Alliance and actively participated in the construction of many co-construction units. The service platform focuses on collecting and publishing resources such as instruments and equipment belonging to the alliance members in order to promote the technological innovation and development of the domestic semiconductor industry.

 

新闻

 

Dinglong, as a leading enterprise in the field of CMP polishing pads in China, and a member unit of the material alliance, its holding subsidiary Hubei Dinghui Microelectronics Materials Co., Ltd. actively responded to this.

Hubei Dinghui Microelectronics Material Co., Ltd. is the only domestic supplier of full-process CMP polishing pads, the only domestic manufacturer with key casting process technology, an international R&D and production team, and world-class advanced imported production Equipment, high-standard dust-free production workshops and the only domestic 200mm and 300mm CMP Pad evaluation laboratory have built an automated CMP polishing pad industrial production line synchronized with the top international manufacturers. The company has strong independent research and development, innovation and engineering industrialization capabilities. The products are applicable to Oxide, W, Cu bulk, and CMP Pad applicable to Barrier; at the same time, the company has strong customization capabilities and can be customized according to customer needs Develop products suitable for their special needs.

 

  01

12 inches

Chemical mechanical grinding machine

AMAT 300 CMP

新闻

 

Perform chemical mechanical polishing on 12-inch wafers.

 

新闻

02  

Rice

KLA P-7

To 8 inch/12 inch

wafer dishing/erosion

Perform testing.

 

  03

AFM

新闻

To 8 inch/12 inch The topography of the wafer surface is scanned.

新闻

04  

nano spec Ⅱ

To 8 inch/12 inch The oxide wafer thickness is measured.

  05

napson RG-300

新闻

To 8 inch/12 inch copper/tungsten wafer the thickness is measured.

新闻

06  

AMAT 300 SEM review

Review the defects of 12-inch wafers.

  07

KLA 300 SP2

新闻

Defect inspection on 12-inch wafers

新闻

08  

8寸

化学机械研磨机台

MAT 200 CMP

Perform chemical mechanical polishing on 8-inch wafers.

 

 

 

 

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