CMP polishing pad is a key material in the CMP process of IC manufacturing. It provides stable and controllable friction in the CMP process while achieving fast and uniform dispersion of polishing fluid. Polishing pad products across the polymer chemistry, polymer physics, organic synthesis, tribology, precision machining and other multidisciplinary fields, the technical complexity is extremely high. Dinglong has the research and development and production capacity of the whole process and whole process of polishing mat products, and is the first company in the world to achieve full coverage of polishing mat model needs.

The polishing liquid is a colloidal with uniform particle distribution, which can produce an oxide film on the surface of the silicon wafer, and then remove it by the abrasive particles in the polishing liquid to achieve the purpose of polishing. Usually, the flow rate, viscosity, temperature, composition, pH value of the polishing liquid will have an impact on the removal effect. Independently solved the core raw material problems of the three series of polishing liquid (silicon series, aluminum series, cerium series).

Mainly used to remove dust particles, organic matter, inorganic matter, metal ions, oxides and other impurities remaining on the surface of the wafer, to meet the extremely high cleanliness requirements of integrated circuit manufacturing, and play an important role in the yield of wafer production. A full range of raw material electronic purification production line, many core materials independent production.

Nano-high purity silicon grinding particles are the most important components of polishing liquid, which act on the surface of the material to be machined through micro-cutting and rolling in the polishing process to achieve the role of mechanical removal of material. Nano high purity silicon is a silica sol abrasive particle prepared by water glass as raw material. Dinglong has independently developed nano-high purity silicon grinding particles with high purity, narrow particle size distribution and high removal efficiency, which realizes the independent control of the core raw materials of polishing liquid.

PI, or Polyimide, is an aromatic heterocyclic polymer with an imide group in its molecular structure. With excellent heat resistance, dimensional stability, mechanical properties and chemical resistance, it is the material at the top of the pyramid. The flexible screen is achieved by replacing the rigid glass material in the manufacturing of the front segment of the OLED panel. It is the only main material involved in the full process of OLED panel manufacturing.

Photosensitive polyimide (PSPI) is a polymer photosensitive composite material, which is the photoresist of AMOLED display process, and is the only core material used in the flat layer (PLN), pixel definition layer (PDL), and support layer (PS) three layers of AMOLED display process.

The packaging material of OLED device, through the IJP process, solidifies into a film under specific environment to form an organic flat layer, which has excellent optical and mechanical properties, and plays the role of water-oxygen barrier. It is the only main material that is completely monopolized by foreign panel factories, and the localization of the material is conducive to the stability of the supply chain of downstream customers.

The main function of the diamond plate is to trim the polishing pad, clean the polishing pad surface debris, prevent the polishing pad surface glazing, improve the surface roughness, ensure the stability and repeatability of the polishing process, and improve the polishing efficiency.

As the core material of ultrathin wafer thinning and holding, temporary bonding adhesive can temporarily fix the device wafer on the carrying carrier, thus providing sufficient mechanical support for the ultrathin device wafer to prevent the warping and fragmentation of the device wafer in the subsequent process, and it can also complete the release of the ultrathin wafer by light, heat and external force.