:
CMP polishing pad is a key material in the CMP process of IC manufacturing. It provides stable and controllable friction in the CMP process while achieving fast and uniform dispersion of polishing fluid. Polishing pad products across the polymer chemistry, polymer physics, organic synthesis, tribology, precision machining and other multidisciplinary fields, the technical complexity is extremely high. Dinglong has the research and development and production capacity of the whole process and whole process of polishing mat products, and is the first company in the world to achieve full coverage of polishing mat model needs.
CMP polishing pad
Category
Semiconductor material
Product description
Parameters
CMP polishing pad is a key material in the CMP process of IC manufacturing. It provides stable and controllable friction in the CMP process while achieving fast and uniform dispersion of polishing fluid. Polishing pad products across the polymer chemistry, polymer physics, organic synthesis, tribology, precision machining and other multidisciplinary fields, the technical complexity is extremely high. Dinglong has the research and development and production capacity of the whole process and whole process of polishing mat products, and is the first company in the world to achieve full coverage of polishing mat model needs.
Previous
None
Next
CMP grinding fluid
Related Products
Hubei Dinglong Holdings Co., Ltd. All rights reserved 鄂ICP05005497-2
Powered by www.300.cn wuhan2