A powerful alliance! Dinglong officially launches the ICMtia joint analysis and testing and technical cooperation service platform
Category: Media coverage
Release time: 2025-04-25
Summary: Starting May 11, 2020, the Joint Analysis and Testing & Technology Cooperation Service Platform (hereinafter referred to as the "Service Platform") officially began operation on the ICMtia (Integrated Circuit Materials Industry Technology Innovation Alliance) website.
Starting May 11, 2020, the Joint Analysis and Testing & Technical Cooperation Service Platform (hereinafter referred to as the "Service Platform") officially launched and is available for use on the ICMtia (Integrated Circuit Materials Industry Technology Innovation Alliance) website.
The Service Platform is a specialized service platform spearheaded by the Materials Alliance, with the active participation of numerous co-construction units. The platform focuses on collecting and publishing resources such as instruments and equipment belonging to alliance members, aiming to promote technological innovation in the domestic semiconductor industry.
As a leading domestic enterprise in the field of CMP polishing pads and a member unit of the Materials Alliance, Dinglong, through its wholly-owned subsidiary, Hubei Ding Hui Microelectronics Materials Co., Ltd., has actively responded to this initiative.
Hubei Ding Hui Microelectronics Materials Co., Ltd. is the only domestic supplier of full-process CMP polishing pads and the only manufacturer with key casting technology. It possesses an international R&D and production team, world-class advanced imported production equipment, a high-standard dust-free production workshop, and the only 200mm and 300mm CMP Pad evaluation laboratory in China. It has established an automated CMP polishing pad industrial production line that keeps pace with international leading manufacturers. The company has strong independent R&D, innovation, and industrialization capabilities. Its products include CMP pads suitable for Oxide, W, Cu bulk, and Barrier applications; simultaneously, the company possesses strong customization capabilities and can customize products to meet specific customer needs.
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01 12-inch Chemical Mechanical Polishing (CMP) machine AMAT 300 CMP |
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Performs chemical mechanical polishing on 12-inch wafers. |
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02 Step Profiler KLA P-7 |
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For 8-inch/12-inch wafer dishing/erosion Testing. |
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03 Atomic Force Microscope AFM |
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Scans the surface morphology of 8-inch/12-inch wafers. |
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04 Oxide Film Thickness Meter nano spec Ⅱ |
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Measures the thickness of 8-inch/12-inch oxide wafers. |
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05 Metal Film Thickness Meter napson RG-300 |
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For 8-inch/12-inch copper/tungsten wafers Thickness measurement. |
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06 12-inch Wafer Defect Scanner AMAT 300 SEM review |
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Reviews defects on 12-inch wafers. |
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07 12-inch Wafer Defect Detection Machine KLA 300 SP2 |
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Performs defect detection on 12-inch wafers. |
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08 8-inch Chemical Mechanical Polishing (CMP) machine MAT 200 CMP |
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Performs chemical mechanical polishing on 8-inch wafers. |
Keywords: A powerful alliance! Dinglong officially launches the ICMtia joint analysis and testing and technical cooperation service platform
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