A powerful alliance! Dinglong officially launches the ICMtia joint analysis and testing and technical cooperation service platform

Category: Media coverage

Release time: 2025-04-25

Summary: Starting May 11, 2020, the Joint Analysis and Testing & Technology Cooperation Service Platform (hereinafter referred to as the "Service Platform") officially began operation on the ICMtia (Integrated Circuit Materials Industry Technology Innovation Alliance) website.

 

 

  Starting May 11, 2020, the Joint Analysis and Testing & Technical Cooperation Service Platform (hereinafter referred to as the "Service Platform") officially launched and is available for use on the ICMtia (Integrated Circuit Materials Industry Technology Innovation Alliance) website.

(Click "Read More" at the bottom of the article to go directly to the platform page)

 

  The Service Platform is a specialized service platform spearheaded by the Materials Alliance, with the active participation of numerous co-construction units. The platform focuses on collecting and publishing resources such as instruments and equipment belonging to alliance members, aiming to promote technological innovation in the domestic semiconductor industry.

 

 

  As a leading domestic enterprise in the field of CMP polishing pads and a member unit of the Materials Alliance, Dinglong, through its wholly-owned subsidiary, Hubei Ding Hui Microelectronics Materials Co., Ltd., has actively responded to this initiative.

  Hubei Ding Hui Microelectronics Materials Co., Ltd. is the only domestic supplier of full-process CMP polishing pads and the only manufacturer with key casting technology. It possesses an international R&D and production team, world-class advanced imported production equipment, a high-standard dust-free production workshop, and the only 200mm and 300mm CMP Pad evaluation laboratory in China. It has established an automated CMP polishing pad industrial production line that keeps pace with international leading manufacturers. The company has strong independent R&D, innovation, and industrialization capabilities. Its products include CMP pads suitable for Oxide, W, Cu bulk, and Barrier applications; simultaneously, the company possesses strong customization capabilities and can customize products to meet specific customer needs.

  01

12-inch

Chemical Mechanical Polishing (CMP) machine

AMAT 300 CMP

Performs chemical mechanical polishing on 12-inch wafers.

 

02  

Step Profiler

KLA P-7

For 8-inch/12-inch

wafer dishing/erosion

Testing.

 

  03

Atomic Force Microscope

AFM

Scans the surface morphology of 8-inch/12-inch wafers.

04  

Oxide Film Thickness Meter

nano spec Ⅱ

Measures the thickness of 8-inch/12-inch oxide wafers.

  05

Metal Film Thickness Meter

napson RG-300

For 8-inch/12-inch copper/tungsten wafers

Thickness measurement.

06  

12-inch Wafer Defect Scanner

AMAT 300 SEM review

Reviews defects on 12-inch wafers.

  07

12-inch Wafer Defect Detection Machine

KLA 300 SP2

Performs defect detection on 12-inch wafers.

08  

8-inch

Chemical Mechanical Polishing (CMP) machine

MAT 200 CMP

Performs chemical mechanical polishing on 8-inch wafers.

 

 

 

 

Keywords: A powerful alliance! Dinglong officially launches the ICMtia joint analysis and testing and technical cooperation service platform

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