The polishing liquid is a colloidal with uniform particle distribution, which can produce an oxide film on the surface of the silicon wafer, and then remove it by the abrasive particles in the polishing liquid to achieve the purpose of polishing. Usually, the flow rate, viscosity, temperature, composition, pH value of the polishing liquid will have an impact on the removal effect. Independently solved the core raw material problems of the three series of polishing liquid (silicon series, aluminum series, cerium series).