Wafer resist is the most critical material in semiconductor fabrication. In the process of photolithography, the circuit pattern can be transferred from the mask to the photoresist after coating, pre-drying, exposure, post-drying and development, and then the circuit pattern can be transferred from the photoresist to the silicon wafer through the etching process. With the reduction of the width of the integrated circuit and the improvement of the integration degree, the technical difficulty of the photoresist development has increased greatly, and it has become one of the key technologies to continue Moore's law.